Invention Reference Number
202405570
An ORNL invention proposes using 3D printing to make conductors with space-filling thin-wall cross sections. Space-filling thin-wall profiles will maximize the conductor volume while restricting the path for eddy currents induction. The developed conductors will simultaneously achieve lower AC loss of Litz wire with good thermal performance and scalability of hairpin windings.
Contact
To learn more about this technology, email partnerships@ornl.gov or call 865-574-1051.
