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Stacked die in power electronics refers to a packaging approach where multiple semiconductor dies are vertically integrated or "stacked" in a single package.
Technologies are described directed to multi-harmonic brushless excitation systems for wound-field synchronous machines.
Misalignment issues of the PWPT system have been addressed. The intercell power transformer has been introduced in order to improve load sharing of the system during a mismatch of the primary single-phase coil and the secondary multi-phase coils.
Induction cooktops are becoming popular; however, a limitation is that compatible cookware is required. This is a significant barrier to its adoption.
The invention discusses charging coil designs that can be utilized as a transformer for plug in EV charging, as well as inductive coils for wireless charging.
Technologies directed to an LCC based induction cooktop architecture for non-ferromagnetic pan are described.
Contact
To learn more about this technology, email partnerships@ornl.gov or call 865-574-1051.
An ORNL invention proposes using 3D printing to make conductors with space-filling thin-wall cross sections. Space-filling thin-wall profiles will maximize the conductor volume while restricting the path for eddy currents induction.
A new, simpler power module and manifold design shows lower weight and volume, which allows higher power density compared with current state of the art.
Wind or hydro power are predominantly large-scale with giant generators to convert wind or water captured by turbines into electricity. But residential-sized wind turbines could generate power for a whole house.
Wireless charging systems need to operate at high frequency, at or near resonance, to maximize power transfer distance and efficiency. High voltages appear across the inductors and capacitors. The use of discrete components reduces efficiency, increases system complexity.