Invention Reference Number
Researchers at Oak Ridge National Laboratory have developed an advanced thermal management design for stacked die power modules. This packaging innovation enhances heat dissipation in compact, high-density power electronics – crucial for next-generation applications such as electric vehicles. The approach reduces junction temperatures while maintaining power density, addressing one of the key limitations of vertical die stacking: effective heat extraction.
Description
Stacked die packaging is gaining attention for its ability to reduce parasitic inductance and footprint in high-power electronics. However, stacking multiple semiconductor dies vertically increases thermal resistance, posing a challenge to maintaining safe device temperatures. To address this, ORNL researchers designed and simulated a multilayer half-bridge power module featuring enhanced thermal paths, innovative cooling configurations, and optimized structural materials. Through numerical modeling and iterative simulation, the team evaluated several design cases – including configurations with extended thermal spreaders, modified connector placements, and double-sided cooling. The final optimized design demonstrated significant reductions in junction-to-coolant thermal resistance and overall device temperatures while preserving a compact form factor and allowing for strategic capacitor placement. This design supports higher switching frequencies and power densities typical of wide-bandgap semiconductor applications while mitigating thermal bottlenecks.
Benefits
- Reduces junction temperatures in stacked die power modules
- Maintains high power density despite compact packaging
- Enables integration of advanced cooling without significant volume increase
- Improves reliability and efficiency in high-switching applications
Applications and Industries
- Electric vehicle powertrains and inverters
- High-density power modules for renewable energy systems
- Aerospace and defense power electronics
- Industrial motor drives and smart grid systems
Contact
To learn more about this technology, email partnerships@ornl.gov or call 865-574-1051.
