Invention Reference Number
The proposed liquid-jet impingement-based cooling system offers a compact, high-performance solution for power electronics by reducing the volume and weight of traditional cooling systems. It increases power density and simplifies design while providing efficient thermal management. The system strategically positions nozzles for targeted cooling, improving reliability and manufacturability without compromising performance.
Description
This cooling system addresses the challenge of efficiently removing heat from high-power electronics, which is critical for ensuring their reliability and performance. Conventional cooling systems rely on bulkier designs that are less efficient. The disclosed system, utilizing a liquid-jet-impingement technique, strategically places nozzles to cool only the most heat-concentrated areas, reducing unnecessary volume and mass. This makes it suitable for compact electronics with high power densities. The system was developed for applications requiring effective heat dissipation while minimizing space, weight, and material costs. The novel manifold design reduces overall weight and volume while maintaining high thermal performance and cooling efficiency.
Benefits
- Simplified design: Fewer components, such as heat sinks or additional layers, reducing complexity and material costs
- Improved reliability: Eliminates layers with high thermal resistance, enhancing the overall system’s performance and longevity
- Cost-effective: Uses materials like polycarbonate for the manifold, reducing manufacturing costs
Applications and Industries
- Electric vehicles: Optimizes thermal management in inverters and power modules for high-power systems
- Data centers: Enhances cooling performance in high-performance computing environments
- Aerospace: Reduces weight while maintaining cooling efficiency, crucial for aviation and space systems
Contact
To learn more about this technology, email partnerships@ornl.gov or call 865-574-1051.
