Researchers at ORNL became the first to 3D-print large rotating steam turbine blades for generating energy in power plants.
Karen White, who works in ORNL’s Neutron Science Directorate, has been honored with a Lifetime Achievement Award.
Researchers used the world’s first exascale supercomputer to run one of the largest simulations of an alloy ever and achieve near-quantum accuracy.
The world’s first exascale supercomputer will help scientists peer into the future of global climate change and open a window into weather patterns that could affect the world a generation from now.
Hilda Klasky, an R&D staff member in the Scalable Biomedical Modeling group at ORNL, has been selected as a senior member of the Association of Computing Machinery, or ACM.
The Hub & Spoke Sustainable Materials & Manufacturing Alliance for Renewable Technologies, or SM2ART, program has been honored with the composites industry’s Combined Strength Award at the Composites and Advanced Materials Expo, or CAMX, 2023 in Atlanta. This distinction goes to the team that applies their knowledge, resources and talent to solve a problem by making the best use of composites materials.
A type of peat moss has surprised scientists with its climate resilience: Sphagnum divinum is actively speciating in response to hot, dry conditions.
In fiscal year 2023 — Oct. 1–Sept. 30, 2023 — Oak Ridge National Laboratory was awarded more than $8 million in technology maturation funding through the Department of Energy’s Technology Commercialization Fund, or TCF.
Steven Campbell can often be found deep among tall cases of power electronics, hunkered in his oversized blue lab coat, with 1500 volts of electricity flowing above his head. When interrupted in his laboratory at ORNL, Campbell will usually smile and duck his head.
Sreenivasa Jaldanki, a researcher in the Grid Systems Modeling and Controls group at the Department of Energy’s Oak Ridge National Laboratory, was recently elevated to senior membership in the Institute of Electrical and Electronics Engineers, or IEEE.