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ORNL and Tuskegee University have formed a partnership to develop new biodegradable materials for use in buildings, transportation and biomedical applications.
Ten scientists from the Department of Energy’s Oak Ridge National Laboratory are among the world’s most highly cited researchers, according to a bibliometric analysis conducted by the scientific publication analytics firm Clarivate.
Researchers at ORNL designed a novel polymer to bind and strengthen silica sand for binder jet additive manufacturing, a 3D-printing method used by industries for prototyping and part production.
Amy Elliott, a group leader for robotics and intelligent systems at Oak Ridge National Laboratory, has received the 2021 ASTM International Additive Manufacturing Young Professional Award for her early career research contributions
Oak Ridge National Laboratory researchers have developed a novel process to manufacture extreme heat resistant carbon-carbon composites. The performance of these materials will be tested in a U.S. Navy rocket that NASA will launch this fall.
A team led by the ORNL has found a rare quantum material in which electrons move in coordinated ways, essentially “dancing.”
Oak Ridge National Laboratory researchers demonstrated that cooling cost savings could be achieved with a 3D printed concrete smart wall following a three-month field test.
A new tool that simulates the energy profile of every building in America will give homeowners, utilities and companies a quick way to determine energy use and cost-effective retrofits that can reduce energy and carbon emissions.
A research team at Oak Ridge National Laboratory have 3D printed a thermal protection shield, or TPS, for a capsule that will launch with the Cygnus cargo spacecraft as part of the supply mission to the International Space Station.
Scientists at ORNL and the University of Tennessee, Knoxville, have found a way to simultaneously increase the strength and ductility of an alloy by introducing tiny precipitates into its matrix and tuning their size and spacing.