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Media Contacts
The Society of Manufacturing Engineers has honored three Oak Ridge National Laboratory researchers with the 2024 SME Susan Smyth Outstanding Young Manufacturing Engineer Award.
Two different teams that included Oak Ridge National Laboratory employees were honored Feb. 20 with Secretary’s Honor Achievement Awards from the Department of Energy. This is DOE's highest form of employee recognition.
Hilda Klasky, an R&D staff member in the Scalable Biomedical Modeling group at ORNL, has been selected as a senior member of the Association of Computing Machinery, or ACM.
The Hub & Spoke Sustainable Materials & Manufacturing Alliance for Renewable Technologies, or SM2ART, program has been honored with the composites industry’s Combined Strength Award at the Composites and Advanced Materials Expo, or CAMX, 2023 in Atlanta. This distinction goes to the team that applies their knowledge, resources and talent to solve a problem by making the best use of composites materials.
Sreenivasa Jaldanki, a researcher in the Grid Systems Modeling and Controls group at the Department of Energy’s Oak Ridge National Laboratory, was recently elevated to senior membership in the Institute of Electrical and Electronics Engineers, or IEEE.
Technologies developed by researchers at ORNL have received six 2023 R&D 100 Awards.
Yarom Polsky, director of the Manufacturing Science Division, or MSD, at the Department of Energy’s Oak Ridge National Laboratory, has been elected a Fellow of the American Society of Mechanical Engineers, or ASME.
Rigoberto Advincula, a renowned scientist at ORNL and professor of Chemical and Biomolecular Engineering at the University of Tennessee, has won the Netzsch North American Thermal Analysis Society Fellows Award for 2023.
Researchers at the Department of Energy’s Oak Ridge National Laboratory and their technologies have received seven 2022 R&D 100 Awards, plus special recognition for a battery-related green technology product.
A force within the supercomputing community, Jack Dongarra developed software packages that became standard in the industry, allowing high-performance computers to become increasingly more powerful in recent decades.