ORNL and Tuskegee University have formed a partnership to develop new biodegradable materials for use in buildings, transportation and biomedical applications.
A team of collaborators from ORNL, Google Inc., Snowflake Inc. and Ververica GmbH has tested a computing concept that could help speed up real-time processing of data that stream on mobile and other electronic devices.
A team led by the U.S. Department of Energy’s Oak Ridge National Laboratory demonstrated the viability of a “quantum entanglement witness” capable of proving the presence of entanglement between magnetic particles, or spins, in a quantum material.
At the Department of Energy’s Oak Ridge National Laboratory, scientists use artificial intelligence, or AI, to accelerate the discovery and development of materials for energy and information technologies.
A multi-institutional team became the first to generate accurate results from materials science simulations on a quantum computer that can be verified with neutron scattering experiments and other practical techniques.
Three technologies developed by ORNL researchers have won National Technology Transfer Awards from the Federal Laboratory Consortium. One of the awards went to a team that adapted melt-blowing capabilities at DOE’s Carbon Fiber Technology Facility to enable the production of filter material for N95 masks in the fight against COVID-19.
Growing up in the heart of the American automobile industry near Detroit, Oak Ridge National Laboratory materials scientist Mike Kirka was no stranger to manufacturing.
Six scientists at the Department of Energy’s Oak Ridge National Laboratory were named Battelle Distinguished Inventors, in recognition of obtaining 14 or more patents during their careers at the lab.
Six ORNL scientists have been elected as fellows to the American Association for the Advancement of Science, or AAAS.
The University of Texas at San Antonio (UTSA) has formally launched the Cybersecurity Manufacturing Innovation Institute (CyManII), a $111 million public-private partnership.