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Researcher
- Steve Bullock
- Corson Cramer
- Ahmed Hassen
- Greg Larsen
- James Klett
- Nadim Hmeidat
- Sam Hollifield
- Trevor Aguirre
- Vlastimil Kunc
- Adam Willoughby
- Chad Steed
- Junghoon Chae
- Mingyan Li
- Rishi Pillai
- Steven Guzorek
- Travis Humble
- Aaron Werth
- Ali Passian
- Beth L Armstrong
- Brandon Johnston
- Brian Weber
- Brittany Rodriguez
- Bruce A Pint
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- Charlie Cook
- Christopher Hershey
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- David Nuttall
- Dustin Gilmer
- Emilio Piesciorovsky
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- Harper Jordan
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- Jiheon Jun
- Joel Asiamah
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- John Lindahl
- Jordan Wright
- Joseph Olatt
- Kevin Spakes
- Kunal Mondal
- Lilian V Swann
- Luke Koch
- Mahim Mathur
- Marie Romedenne
- Mark Provo II
- Mary A Adkisson
- Michael Kirka
- Nance Ericson
- Oscar Martinez
- Priyanshi Agrawal
- Raymond Borges Hink
- Rob Root
- Samudra Dasgupta
- Sana Elyas
- Srikanth Yoginath
- Subhabrata Saha
- T Oesch
- Tomonori Saito
- Tony Beard
- Tyler Smith
- Varisara Tansakul
- Vipin Kumar
- Yarom Polsky
- Yong Chae Lim
- Zhili Feng

The technology will offer supportless DIW of complex structures using vinyl ester resin, facilitated by multidirectional 6 axis printing.

The ever-changing cellular communication landscape makes it difficult to identify, map, and localize commercial and private cellular base stations (PCBS).

The technologies provide additively manufactured thermal protection system.

A novel method that prevents detachment of an optical fiber from a metal/alloy tube and allows strain measurement up to higher temperatures, about 800 C has been developed. Standard commercial adhesives typically only survive up to about 400 C.

Reflective and emissive surfaces are designed with heat retention as opposed to the current state of the art oven and furnaces which use non-reflective surfaces. Heat is absorbed and transferred to the exterior of the heated appliances.

This invention focuses on improving the ceramic yield of preceramic polymers by tuning the crosslinking process that occurs during vat photopolymerization (VP).

Test facilities to evaluate materials compatibility in hydrogen are abundant for high pressure and low temperature (<100C).

The QVis Quantum Device Circuit Optimization Module gives users the ability to map a circuit to a specific quantum devices based on the device specifications.

QVis is a visual analytics tool that helps uncover temporal and multivariate variations in noise properties of quantum devices.

Using all polymer formulations, the PIP densification is improved almost 70% over traditional preceramic polymers and PIP material leading to cost and times saving for densifying ceramic composites made from powder or fibers.