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Researcher
- Amit Shyam
- Alex Plotkowski
- Sam Hollifield
- Adam Willoughby
- Chad Steed
- James A Haynes
- Junghoon Chae
- Mingyan Li
- Rishi Pillai
- Ryan Dehoff
- Sumit Bahl
- Travis Humble
- Aaron Werth
- Adam Stevens
- Alice Perrin
- Ali Passian
- Andres Marquez Rossy
- Brandon Johnston
- Brian Post
- Brian Weber
- Bruce A Pint
- Charles Hawkins
- Christopher Fancher
- Dean T Pierce
- Emilio Piesciorovsky
- Gary Hahn
- Gerry Knapp
- Gordon Robertson
- Harper Jordan
- Isaac Sikkema
- Jason Jarnagin
- Jay Reynolds
- Jeff Brookins
- Jiheon Jun
- Joel Asiamah
- Joel Dawson
- Joseph Olatt
- Jovid Rakhmonov
- Kevin Spakes
- Kunal Mondal
- Lilian V Swann
- Luke Koch
- Mahim Mathur
- Marie Romedenne
- Mark Provo II
- Mary A Adkisson
- Nance Ericson
- Nicholas Richter
- Oscar Martinez
- Peeyush Nandwana
- Peter Wang
- Priyanshi Agrawal
- Rangasayee Kannan
- Raymond Borges Hink
- Rob Root
- Roger G Miller
- Samudra Dasgupta
- Sarah Graham
- Srikanth Yoginath
- Sudarsanam Babu
- Sunyong Kwon
- T Oesch
- Varisara Tansakul
- William Peter
- Yarom Polsky
- Ying Yang
- Yong Chae Lim
- Yukinori Yamamoto
- Zhili Feng

Currently available cast Al alloys are not suitable for various high-performance conductor applications, such as rotor, inverter, windings, busbar, heat exchangers/sinks, etc.

The ever-changing cellular communication landscape makes it difficult to identify, map, and localize commercial and private cellular base stations (PCBS).

The invented alloys are a new family of Al-Mg alloys. This new family of Al-based alloys demonstrate an excellent ductility (10 ± 2 % elongation) despite the high content of impurities commonly observed in recycled aluminum.

The lack of real-time insights into how materials evolve during laser powder bed fusion has limited the adoption by inhibiting part qualification. The developed approach provides key data needed to fabricate born qualified parts.

A novel method that prevents detachment of an optical fiber from a metal/alloy tube and allows strain measurement up to higher temperatures, about 800 C has been developed. Standard commercial adhesives typically only survive up to about 400 C.

Test facilities to evaluate materials compatibility in hydrogen are abundant for high pressure and low temperature (<100C).

The QVis Quantum Device Circuit Optimization Module gives users the ability to map a circuit to a specific quantum devices based on the device specifications.

QVis is a visual analytics tool that helps uncover temporal and multivariate variations in noise properties of quantum devices.