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An ORNL invention proposes using 3D printing to make conductors with space-filling thin-wall cross sections. Space-filling thin-wall profiles will maximize the conductor volume while restricting the path for eddy currents induction.

ORNL's fully on-chip CMOS-fabricated integrated photonic circuit can generate polarization or frequency entangled photons for use in quantum communications and networking.

This work seeks to alter the interface condition through thermal history modification, deposition energy density, and interface surface preparation to prevent interface cracking.

Additive manufacturing (AM) enables the incremental buildup of monolithic components with a variety of materials, and material deposition locations.

The invention is related to the implementation of an bi-directional and isolated electric vehicle charger. The bidirectionality allows the electric vehicles to support the grid in case of disturbances thereby reducing the stress on the existing infrastructure.

Photonic hyperentanglement involves pairs of photons entangled in multiple degrees of freedom (DoF), which hold promise for quantum communication protocols. However, the frequency DoF has received less attention due to constraints in evaluating such hyperentangled states.

Ceramic matrix composites are used in several industries, such as aerospace, for lightweight, high quality and high strength materials. But producing them is time consuming and often low quality.

This disclosure presents a framework to identify critical conditions that an autonomous driving system will encounter on its mission.

Power utilities are increasingly deploying intelligent electronic devices inside and outside substations. Sharing data in substations between utility-owned devices and customer-owned distributed energy resources (DERs) risks the integrity and confidentiality of that data.