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Researcher
- Steve Bullock
- Corson Cramer
- Vlastimil Kunc
- Ahmed Hassen
- Greg Larsen
- James Klett
- Nadim Hmeidat
- Steven Guzorek
- Trevor Aguirre
- Chad Steed
- Dan Coughlin
- Junghoon Chae
- Subhabrata Saha
- Travis Humble
- Vipin Kumar
- Beth L Armstrong
- Brittany Rodriguez
- Charlie Cook
- Christopher Hershey
- Christopher Ledford
- Craig Blue
- Daniel Rasmussen
- David J Mitchell
- David Nuttall
- Dustin Gilmer
- Jim Tobin
- John Lindahl
- Jordan Wright
- Josh Crabtree
- Kim Sitzlar
- Merlin Theodore
- Michael Kirka
- Samudra Dasgupta
- Sana Elyas
- Tomonori Saito
- Tony Beard
- Tyler Smith

The technology will offer supportless DIW of complex structures using vinyl ester resin, facilitated by multidirectional 6 axis printing.

The technologies provide additively manufactured thermal protection system.

Reflective and emissive surfaces are designed with heat retention as opposed to the current state of the art oven and furnaces which use non-reflective surfaces. Heat is absorbed and transferred to the exterior of the heated appliances.

This invention focuses on improving the ceramic yield of preceramic polymers by tuning the crosslinking process that occurs during vat photopolymerization (VP).

The QVis Quantum Device Circuit Optimization Module gives users the ability to map a circuit to a specific quantum devices based on the device specifications.

QVis is a visual analytics tool that helps uncover temporal and multivariate variations in noise properties of quantum devices.

Using all polymer formulations, the PIP densification is improved almost 70% over traditional preceramic polymers and PIP material leading to cost and times saving for densifying ceramic composites made from powder or fibers.

The technologies provide a system and method of needling of veiled AS4 fabric tape.

Fiberglass, semi-structural insulation for recycled glass fiber and using a low cost silicon with pultruded rods, either fiberglass and a low cost resin, polyester for pultruded rods. It will reduce the use of wood, which is flammable, and still be structural.