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Researcher
- Beth L Armstrong
- Rafal Wojda
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- Jun Qu
- Prasad Kandula
- Singanallur Venkatakrishnan
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- Marm Dixit
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- Nancy Dudney
- Nicholas Richter
- Nolan Hayes
- Obaid Rahman
- Omer Onar
- Peeyush Nandwana
- Peter Wang
- Praveen Kumar
- Rangasayee Kannan
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- Sergiy Kalnaus
- Subho Mukherjee
- Suman Debnath
- Sunyong Kwon
- Tolga Aytug
- Trevor Aguirre
- Ying Yang
- Yiyu Wang

ORNL researchers have developed a deep learning-based approach to rapidly perform high-quality reconstructions from sparse X-ray computed tomography measurements.

Misalignment issues of the PWPT system have been addressed. The intercell power transformer has been introduced in order to improve load sharing of the system during a mismatch of the primary single-phase coil and the secondary multi-phase coils.

Currently available cast Al alloys are not suitable for various high-performance conductor applications, such as rotor, inverter, windings, busbar, heat exchangers/sinks, etc.

The invented alloys are a new family of Al-Mg alloys. This new family of Al-based alloys demonstrate an excellent ductility (10 ± 2 % elongation) despite the high content of impurities commonly observed in recycled aluminum.

We have been working to adapt background oriented schlieren (BOS) imaging to directly visualize building leakage, which is fast and easy.

A new nanostructured bainitic steel with accelerated kinetics for bainite formation at 200 C was designed using a coupled CALPHAD, machine learning, and data mining approach.

Using all polymer formulations, the PIP densification is improved almost 70% over traditional preceramic polymers and PIP material leading to cost and times saving for densifying ceramic composites made from powder or fibers.

An ORNL invention proposes using 3D printing to make conductors with space-filling thin-wall cross sections. Space-filling thin-wall profiles will maximize the conductor volume while restricting the path for eddy currents induction.

New demands in electric vehicles have resulted in design changes for the power electronic components such as the capacitor to incur lower volume, higher operating temperatures, and dielectric properties (high dielectric permittivity and high electrical breakdown strengths).