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Method to Determine Maximum Allowable Sinterable Silver Interconnect Size

by Andrew A Wereszczak, Max C Modugno, Shirley B Waters, Douglas Devoto, Paul Paret
Publication Type
Conference Paper
Publication Date
Conference Name
2016 IMAPS International Conference on High Temperature Electronics (HiTEC 2016)
Conference Location
Albuquerque, New Mexico, United States of America
Conference Date