Andrew A Wereszczak

Bio

Professional Interests:

• Mechanical Response of Materials and their Linkage to Processing.
• Contact Damage Resistance and Microstructures in Armor Ceramics.
• Interconnect Processing of Electronic Ceramic Components and Devices.
• Mechanical Reliability of Electronic Ceramic Components and Devices.
• Thermal Management of Power Electronic and Electric Motor Devices.
• Probabilistic Life Prediction and Design of Structural Ceramic Components.
• Micromechanical and In-Situ Testing/Analysis of Ceramics and Coatings.
• Fracture Mechanics, Finite Element Method, and Applied Mathematics.
• Fatigue and Creep Phenomena in Ceramic and Structural Materials.
• Mechanical Test and Analysis Methods.

Education:

• Ph. D., Materials Science and Engineering, University of Delaware, Newark, Delaware, 1992.
• B. S., Ceramic Engineering, Alfred University, Alfred, New York, 1987.

Professional Experience:

• Distinguished Scientist [1/2009 - present]
  Ceramic Science and Technology Group, High Temperature Materials Laboratory, Materials Science and Technology Division, Oak Ridge National Laboratory, Oak Ridge, TN  37831
  Principal investigator (PI) of DOE- and DOD- and industry-sponsored programs that:  (1) perform reliability analysis and probabilistic design of thermoelectric devices, (2) process thermally conductive epoxy molding compounds, (3) characterize contact damage evolution in armor ceramics and link to material microstructure, (4) improve and refine silver-sinter processing as a joining mechanism between constituents in electronic devices, (5) nurtures thermal management analysis collaboration between ORNL/NTRC and NREL on the EERE VT APEEM Program, and (6) link non-destructive evaluation of surface-type flaws and corresponding mechanical response of glass.
  Secondary investigator (SI) of DOE-sponsored programs that:  (7) evaluate the architecture and constituents of state-of-the-art power electronic devices and motor components, (8) provide Ag-sintering and microstructural evaluation support to WBG electronic devices fabricated under the EERE VT APEEM Program, and (9) provide characterization and processing support of automotive OEM thermoelectric module development.
• Senior Staff Scientist [9/2002 - 12/2008]
  Ceramic Science and Technology Group, High Temperature Materials Laboratory, Materials Science and Technology Division, Oak Ridge National Laboratory, Oak Ridge, TN  37831
• Adjoint Faculty [1/2006 - present]
  Department of Mechanical Engineering, Vanderbilt University, Nashville, TN  37235
• Materials Engineer DB IV   [5/2002 - 8/2002]
  Materials Engineer DB III   [5/2000 - 5/2002]
  Emerging Materials and Analysis Team, Metals and Ceramics Research Branch, Weapons and Materials Research Directorate, U.S. Army Research Laboratory, Aberdeen Proving Ground, MD  21005
• Staff Development Engineer II   [9/1996 - 5/2000]
• Staff Development Engineer I   [9/1992 - 9/1996]
• Development Associate III   [11/1991 - 9/1992]
  Mechanical Characterization & Analysis Group, High Temperature Materials Laboratory, Metals and Ceramics Division, Oak Ridge National Laboratory, Oak Ridge, TN  37831
  Directed the research, or participated, on five DOE-funded programs between 11/1991-5/2000:  (1) the Mechanical Properties User Center at the High Temperature Materials Laboratory, (2) the Heavy Vehicle Propulsion System Materials Program, (3) the Advanced Automotive Materials Program, (4) the Advanced Industrial Materials Program, and (5) the Industrial Microturbine Development Program.  Was principal investigator on the latter four programs.  Responsibilities that were common to all these programs were technical management, experimental design and organization, materials and mechanical testing and analyses, interpretation of results and their presentation and publication, milestone accomplishment, and industry collaboration.