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Impact of Heat Dissipation Profiles on Power Electronics Packaging Design

by Tong Wu, Burak Ozpineci
Publication Type
Journal Name
IEEE Transportation Electrification Conference and Expo
Publication Date
Page Numbers
482 to 487

This paper focuses on understanding the thermal impacts of using discrete power devices and limitations of applying conventional thermal design methods. Empirically, a thermal system is designed based on selecting a heat sink with the required thermal resistance from the manufacturer datasheet. This method, as an approximate estimation, has been proven effective as a rough design of Si-based power module. However, wide bandgap (WBG) bare dies bring additional thermal design concerns that have been overlooked. The benefits of WBG devices, such as smaller chip sizes and higher power ratings, on the other hand, lead to thermal concentration issues. Detailed analyses and impacts of the thermal concentration are presented in this paper. A more accurate model involving Finite Element Analysis (FEA) and Genetic Algorithm Optimization is also proposed for a more accurate thermal design.