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Researcher
- Corson Cramer
- Steve Bullock
- Greg Larsen
- James Klett
- Trevor Aguirre
- Vlastimil Kunc
- Yaosuo Xue
- Ahmed Hassen
- Beth L Armstrong
- Charlie Cook
- Christopher Hershey
- Christopher Ledford
- Craig Blue
- Daniel Rasmussen
- David J Mitchell
- Dustin Gilmer
- Fei Wang
- Jason Jarnagin
- John Lindahl
- Jordan Wright
- Kevin Spakes
- Lilian V Swann
- Mark Provo II
- Michael Kirka
- Nadim Hmeidat
- Phani Ratna Vanamali Marthi
- Rafal Wojda
- Rob Root
- Sam Hollifield
- Sana Elyas
- Sreenivasa Jaldanki
- Steven Guzorek
- Suman Debnath
- Sunil Subedi
- Tomonori Saito
- Tony Beard
- Yonghao Gui

The ever-changing cellular communication landscape makes it difficult to identify, map, and localize commercial and private cellular base stations (PCBS).

The technologies provide additively manufactured thermal protection system.

This invention focuses on improving the ceramic yield of preceramic polymers by tuning the crosslinking process that occurs during vat photopolymerization (VP).

Measurements of grid voltage and current are essential for the optimal operation of the grid protection and control (P&C) systems.

Using all polymer formulations, the PIP densification is improved almost 70% over traditional preceramic polymers and PIP material leading to cost and times saving for densifying ceramic composites made from powder or fibers.

The technologies provide a system and method of needling of veiled AS4 fabric tape.

Fiberglass, semi-structural insulation for recycled glass fiber and using a low cost silicon with pultruded rods, either fiberglass and a low cost resin, polyester for pultruded rods. It will reduce the use of wood, which is flammable, and still be structural.

Multi-terminal DC (MTdc) systems based on high-voltage DC (HVDC) transmission technology is an upcoming concept. In such systems, either asymmetric monopole or bi-pole systems are generally employed. Such systems are not suitable for easy expansion.

The ID provides a solution approach for faster chemical processing and carbon functional grading from SiC to MC to provide a tougher carbon and CMC structure.