Filter Results
Related Organization
- Biological and Environmental Systems Science Directorate (29)
- Computing and Computational Sciences Directorate (39)
- Energy Science and Technology Directorate (229)
- Fusion and Fission Energy and Science Directorate (24)
- Information Technology Services Directorate (3)
- Isotope Science and Enrichment Directorate (7)
- National Security Sciences Directorate (20)
- Neutron Sciences Directorate (11)
- Physical Sciences Directorate (138)
- User Facilities (28)
Researcher
- Steve Bullock
- Chris Tyler
- Corson Cramer
- Justin West
- Rama K Vasudevan
- Ritin Mathews
- Sergei V Kalinin
- Yongtao Liu
- Ahmed Hassen
- Greg Larsen
- James Klett
- Kevin M Roccapriore
- Kyle Kelley
- Maxim A Ziatdinov
- Nadim Hmeidat
- Olga S Ovchinnikova
- Trevor Aguirre
- Vlastimil Kunc
- David Olvera Trejo
- J.R. R Matheson
- Jaydeep Karandikar
- Kashif Nawaz
- Scott Smith
- Stephen Jesse
- Steven Guzorek
- Akash Jag Prasad
- An-Ping Li
- Andrew Lupini
- Anton Ievlev
- Arpan Biswas
- Benjamin Lawrie
- Beth L Armstrong
- Bogdan Dryzhakov
- Brian Fricke
- Brian Gibson
- Brian Post
- Brittany Rodriguez
- Calen Kimmell
- Charlie Cook
- Chengyun Hua
- Christopher Hershey
- Christopher Ledford
- Christopher Rouleau
- Costas Tsouris
- Craig Blue
- Dan Coughlin
- Daniel Rasmussen
- David J Mitchell
- David Nuttall
- Debangshu Mukherjee
- Dustin Gilmer
- Emma Betters
- Gabor Halasz
- Gerd Duscher
- Greg Corson
- Gs Jung
- Gyoung Gug Jang
- Hoyeon Jeon
- Huixin (anna) Jiang
- Ilia N Ivanov
- Ivan Vlassiouk
- Jamieson Brechtl
- Jesse Heineman
- Jewook Park
- Jiaqiang Yan
- John Lindahl
- John Potter
- Jong K Keum
- Jordan Wright
- Josh B Harbin
- Kai Li
- Kyle Gluesenkamp
- Liam Collins
- Mahshid Ahmadi-Kalinina
- Marti Checa Nualart
- Md Inzamam Ul Haque
- Michael Kirka
- Mina Yoon
- Neus Domingo Marimon
- Nickolay Lavrik
- Ondrej Dyck
- Petro Maksymovych
- Radu Custelcean
- Saban Hus
- Sai Mani Prudhvi Valleti
- Sana Elyas
- Steven Randolph
- Subhabrata Saha
- Sumner Harris
- Tomonori Saito
- Tony Beard
- Tony L Schmitz
- Tyler Smith
- Utkarsh Pratiush
- Vipin Kumar
- Vladimir Orlyanchik
- Zhiming Gao

The technology will offer supportless DIW of complex structures using vinyl ester resin, facilitated by multidirectional 6 axis printing.

Dual-GP addresses limitations in traditional GPBO-driven autonomous experimentation by incorporating an additional surrogate observer and allowing human oversight, this technique improves optimization efficiency via data quality assessment and adaptability to unanticipated exp

The technologies provide additively manufactured thermal protection system.

System and method for part porosity monitoring of additively manufactured components using machining
In additive manufacturing, choice of process parameters for a given material and geometry can result in porosities in the build volume, which can result in scrap.

Reflective and emissive surfaces are designed with heat retention as opposed to the current state of the art oven and furnaces which use non-reflective surfaces. Heat is absorbed and transferred to the exterior of the heated appliances.

This invention focuses on improving the ceramic yield of preceramic polymers by tuning the crosslinking process that occurs during vat photopolymerization (VP).

Distortion generated during additive manufacturing of metallic components affect the build as well as the baseplate geometries. These distortions are significant enough to disqualify components for functional purposes.

The invention introduces a novel, customizable method to create, manipulate, and erase polar topological structures in ferroelectric materials using atomic force microscopy.

For additive manufacturing of large-scale parts, significant distortion can result from residual stresses during deposition and cooling. This can result in part scraps if the final part geometry is not contained in the additively manufactured preform.

High coercive fields prevalent in wurtzite ferroelectrics present a significant challenge, as they hinder efficient polarization switching, which is essential for microelectronic applications.