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- Brian Post
- Steve Bullock
- Corson Cramer
- Ahmed Hassen
- Peter Wang
- Amit Shyam
- Andrzej Nycz
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- Anees Alnajjar
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- Haowen Xu
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- Isha Bhandari
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- Scott Smith
- Sheng Dai
- Subhabrata Saha
- Sunyong Kwon
- Tomonori Saito
- Tony Beard
- Tyler Smith
- Varisara Tansakul
- Vipin Kumar
- William Carter
- William Peter
- Ying Yang
- Yukinori Yamamoto

The technology will offer supportless DIW of complex structures using vinyl ester resin, facilitated by multidirectional 6 axis printing.

The eDICEML digital twin is proposed which emulates networks and hosts of an instrument-computing ecosystem. It runs natively on an ecosystem’s host or as a portable virtual machine.

Here we present a solution for practically demonstrating path-aware routing and visualizing a self-driving network.

Currently available cast Al alloys are not suitable for various high-performance conductor applications, such as rotor, inverter, windings, busbar, heat exchangers/sinks, etc.

The invented alloys are a new family of Al-Mg alloys. This new family of Al-based alloys demonstrate an excellent ductility (10 ± 2 % elongation) despite the high content of impurities commonly observed in recycled aluminum.

The technologies provide additively manufactured thermal protection system.

This manufacturing method uses multifunctional materials distributed volumetrically to generate a stiffness-based architecture, where continuous surfaces can be created from flat, rapidly produced geometries.

The lack of real-time insights into how materials evolve during laser powder bed fusion has limited the adoption by inhibiting part qualification. The developed approach provides key data needed to fabricate born qualified parts.

Reflective and emissive surfaces are designed with heat retention as opposed to the current state of the art oven and furnaces which use non-reflective surfaces. Heat is absorbed and transferred to the exterior of the heated appliances.

This invention focuses on improving the ceramic yield of preceramic polymers by tuning the crosslinking process that occurs during vat photopolymerization (VP).