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The invention presented here addresses key challenges associated with counterfeit refrigerants by ensuring safety, maintaining system performance, supporting environmental compliance, and mitigating health and legal risks.
This manufacturing method uses multifunctional materials distributed volumetrically to generate a stiffness-based architecture, where continuous surfaces can be created from flat, rapidly produced geometries.
This invention aims to develop a new feature for a heat pump water heater having a forced flow condenser, coupled with a mixing valve, and a new feature to maximize the first hour rating and provide quick response to hot water demand, comparable to a typical gas water heater.&
Among the methods for point source carbon capture, the absorption of CO2 using aqueous amines (namely MEA) from the post-combustion gas stream is currently considered the most promising.
Develop an innovative refrigerator having a thermoelectric cooler cascaded with a regular refrigerator compression system. the TE cooler dedicatedly controls the temperature in a freezer compartment.
The lack of real-time insights into how materials evolve during laser powder bed fusion has limited the adoption by inhibiting part qualification. The developed approach provides key data needed to fabricate born qualified parts.
Estimates based on the U.S. Department of Energy (DOE) test procedure for water heaters indicate that the equivalent of 350 billion kWh worth of hot water is discarded annually through drains, and a large portion of this energy is, in fact, recoverable.
A valve solution that prevents cross contamination while allowing for blocking multiple channels at once using only one actuator.
Materials produced via additive manufacturing, or 3D printing, can experience significant residual stress, distortion and cracking, negatively impacting the manufacturing process.
This work seeks to alter the interface condition through thermal history modification, deposition energy density, and interface surface preparation to prevent interface cracking.