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ORNL's fully on-chip CMOS-fabricated integrated photonic circuit can generate polarization or frequency entangled photons for use in quantum communications and networking.

This work seeks to alter the interface condition through thermal history modification, deposition energy density, and interface surface preparation to prevent interface cracking.

Additive manufacturing (AM) enables the incremental buildup of monolithic components with a variety of materials, and material deposition locations.

The traditional window installation process involves many steps. These are becoming even more complex with newer construction requirements such as installation of windows over exterior continuous insulation walls.

The use of class A3 and A2L refrigerants to replace conventional hydrofluorocarbons for their low global warming potential (GWP) presents risks due to leaks of flammable mixtures that could result in fire or explosion.

The quality and quantity of refrigerant charge in any vapor compression-based heating and cooling system is vital to its energy efficiency, thermal capacity, and reliability.

Photonic hyperentanglement involves pairs of photons entangled in multiple degrees of freedom (DoF), which hold promise for quantum communication protocols. However, the frequency DoF has received less attention due to constraints in evaluating such hyperentangled states.

Performance of heat exchangers greatly suffers due to maldistribution of fluid, which also impacts the performance of the entire HVAC system. One method to reduce fluid maldistribution is to improve the design of the manifold to make the flow evenly distributed.