31 - 40 of 58 Results
ORNL's fully on-chip CMOS-fabricated integrated photonic circuit can generate polarization or frequency entangled photons for use in quantum communications and networking.
This work seeks to alter the interface condition through thermal history modification, deposition energy density, and interface surface preparation to prevent interface cracking.
Additive manufacturing (AM) enables the incremental buildup of monolithic components with a variety of materials, and material deposition locations.
New demands in electric vehicles have resulted in design changes for the power electronic components such as the capacitor to incur lower volume, higher operating temperatures, and dielectric properties (high dielectric permittivity and high electrical breakdown strengths).
Fiberglass, semi-structural insulation for recycled glass fiber and using a low cost silicon with pultruded rods, either fiberglass and a low cost resin, polyester for pultruded rods. It will reduce the use of wood, which is flammable, and still be structural.
Through the use of splicing methods, joining two different fiber types in the tow stage of the process enables great benefits to the strength of the material change.
Photonic hyperentanglement involves pairs of photons entangled in multiple degrees of freedom (DoF), which hold promise for quantum communication protocols. However, the frequency DoF has received less attention due to constraints in evaluating such hyperentangled states.
Ceramic matrix composites are used in several industries, such as aerospace, for lightweight, high quality and high strength materials. But producing them is time consuming and often low quality.
This disclosure presents a framework to identify critical conditions that an autonomous driving system will encounter on its mission.