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Researcher
- Ryan Dehoff
- Kyle Kelley
- Rama K Vasudevan
- Srikanth Yoginath
- James J Nutaro
- Michael Kirka
- Pratishtha Shukla
- Sergei V Kalinin
- Sudip Seal
- Vincent Paquit
- Adam Stevens
- Ahmed Hassen
- Alex Plotkowski
- Alice Perrin
- Ali Passian
- Amir K Ziabari
- Amit Shyam
- Andres Marquez Rossy
- Anton Ievlev
- Blane Fillingim
- Bogdan Dryzhakov
- Brian Post
- Christopher Ledford
- Clay Leach
- David Nuttall
- Harper Jordan
- James Haley
- Joel Asiamah
- Joel Dawson
- Kevin M Roccapriore
- Liam Collins
- Marti Checa Nualart
- Maxim A Ziatdinov
- Nance Ericson
- Neus Domingo Marimon
- Olga S Ovchinnikova
- Patxi Fernandez-Zelaia
- Peeyush Nandwana
- Philip Bingham
- Rangasayee Kannan
- Roger G Miller
- Sarah Graham
- Singanallur Venkatakrishnan
- Stephen Jesse
- Steven Randolph
- Sudarsanam Babu
- Varisara Tansakul
- Vipin Kumar
- Vlastimil Kunc
- William Peter
- Yan-Ru Lin
- Ying Yang
- Yongtao Liu
- Yukinori Yamamoto

The invention introduces a novel, customizable method to create, manipulate, and erase polar topological structures in ferroelectric materials using atomic force microscopy.

High coercive fields prevalent in wurtzite ferroelectrics present a significant challenge, as they hinder efficient polarization switching, which is essential for microelectronic applications.

Digital twins (DTs) have emerged as essential tools for monitoring, predicting, and optimizing physical systems by using real-time data.

Simulation cloning is a technique in which dynamically cloned simulations’ state spaces differ from their parent simulation due to intervening events.

High strength, oxidation resistant refractory alloys are difficult to fabricate for commercial use in extreme environments.

In manufacturing parts for industry using traditional molds and dies, about 70 percent to 80 percent of the time it takes to create a part is a result of a relatively slow cooling process.

This technology combines 3D printing and compression molding to produce high-strength, low-porosity composite articles.

This invention presents technologies for characterizing physical properties of a sample's surface by combining image processing with machine learning techniques.