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Researcher
- Corson Cramer
- Steve Bullock
- Vlastimil Kunc
- Greg Larsen
- James Klett
- Trevor Aguirre
- Ahmed Hassen
- Mingyan Li
- Sam Hollifield
- Steven Guzorek
- Beth L Armstrong
- Brian Weber
- Charlie Cook
- Christopher Hershey
- Christopher Ledford
- Craig Blue
- Dan Coughlin
- Daniel Rasmussen
- David J Mitchell
- Dustin Gilmer
- Isaac Sikkema
- Jim Tobin
- John Lindahl
- Jordan Wright
- Joseph Olatt
- Josh Crabtree
- Kevin Spakes
- Kim Sitzlar
- Kunal Mondal
- Lilian V Swann
- Luke Koch
- Mahim Mathur
- Mary A Adkisson
- Merlin Theodore
- Michael Kirka
- Nadim Hmeidat
- Oscar Martinez
- Sana Elyas
- Subhabrata Saha
- T Oesch
- Tomonori Saito
- Tony Beard
- Vipin Kumar

The technologies provide additively manufactured thermal protection system.

This invention focuses on improving the ceramic yield of preceramic polymers by tuning the crosslinking process that occurs during vat photopolymerization (VP).

Using all polymer formulations, the PIP densification is improved almost 70% over traditional preceramic polymers and PIP material leading to cost and times saving for densifying ceramic composites made from powder or fibers.

The technologies provide a system and method of needling of veiled AS4 fabric tape.

Fiberglass, semi-structural insulation for recycled glass fiber and using a low cost silicon with pultruded rods, either fiberglass and a low cost resin, polyester for pultruded rods. It will reduce the use of wood, which is flammable, and still be structural.

Through the use of splicing methods, joining two different fiber types in the tow stage of the process enables great benefits to the strength of the material change.

Real-time tracking and monitoring of radioactive/nuclear materials during transportation is a critical need to ensure safety and security. Current technologies rely on simple tagging, using sensors attached to transport containers, but they have limitations.

The ID provides a solution approach for faster chemical processing and carbon functional grading from SiC to MC to provide a tougher carbon and CMC structure.