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ORNL researchers have developed a new method for producing thermoset foam insulation with improved processing and installation outcomes.
The ID provides a solution approach for faster chemical processing and carbon functional grading from SiC to MC to provide a tougher carbon and CMC structure.
The solution proposed here is a modified carbon-based tile face that is mechanically combined with an insulative backing. The tile face is based on a material architecture to minimize weight and thermal conductivity while maximizing thermal stability.
Wireless charging systems need to operate at high frequency, at or near resonance, to maximize power transfer distance and efficiency. High voltages appear across the inductors and capacitors. The use of discrete components reduces efficiency, increases system complexity.
Important of the application is enabling a cost-effective precision manufacturing method Current technology is limited to injection molded individual pi-joints limiting control of pi-joint direction, this creates hurdle in introducing high volume production to the composite in
This technology aims to provide and integrated and oxidation resistant cladding or coating onto carbon-based composites in seconds.
This invention demonstrates the strong potential for hybridization of CNF with natural fibers for facile drying and inclusion of the CNF into polymer matrices for high performance composites.