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Researcher
- Ahmed Hassen
- Brian Post
- Vlastimil Kunc
- Andrzej Nycz
- Peter Wang
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- Corson Cramer
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- Michelle Kidder
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- Halil Tekinalp
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- Sudarsanam Babu
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- Bryan Maldonado Puente
- Carrie Eckert
- Christopher Ledford
- Clay Leach
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- Georges Chahine
- Gs Jung
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- Amit Shyam
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- Xianhui Zhao
- Yan-Ru Lin
- Yang Liu
- Yarom Polsky
- Yasemin Kaygusuz
- Yeonshil Park
- Ying Yang
- Yukinori Yamamoto
- Zackary Snow

The technologies described provides for the upcycling of mixed plastics to muonic acid and 3-hydroxyacids.

Using all polymer formulations, the PIP densification is improved almost 70% over traditional preceramic polymers and PIP material leading to cost and times saving for densifying ceramic composites made from powder or fibers.

Sensing of additive manufacturing processes promises to facilitate detailed quality inspection at scales that have seldom been seen in traditional manufacturing processes.

This invention is for bacterial strains that can utilize lignocellulose sugars. This will improve the efficiency of bioproduct formation in these strains and reduce the greenhouse-gas emission of an industrial bi

The technologies provide a system and method of needling of veiled AS4 fabric tape.

Orphan bHLH enhances plant biomass gain. The orphan bHLH gene has an exclusive nuclear subcellular localization with a transcriptional activator activity.

This work seeks to alter the interface condition through thermal history modification, deposition energy density, and interface surface preparation to prevent interface cracking.

Additive manufacturing (AM) enables the incremental buildup of monolithic components with a variety of materials, and material deposition locations.

Quantifying tool wear is historically challenging task due to variable human interpretation. This capture system will allow for an entire side and the complete end of the cutting tool to be analyzed.

New demands in electric vehicles have resulted in design changes for the power electronic components such as the capacitor to incur lower volume, higher operating temperatures, and dielectric properties (high dielectric permittivity and high electrical breakdown strengths).