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Researcher
- Steve Bullock
- Chris Tyler
- Corson Cramer
- Justin West
- Ritin Mathews
- Ahmed Hassen
- Greg Larsen
- James Klett
- Nadim Hmeidat
- Sam Hollifield
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- J.R. R Matheson
- Jaydeep Karandikar
- Junghoon Chae
- Mingyan Li
- Scott Smith
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- Travis Humble
- Aaron Werth
- Akash Jag Prasad
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- Harper Jordan
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- Josh B Harbin
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- Kunal Mondal
- Lilian V Swann
- Luke Koch
- Mahim Mathur
- Mark Provo II
- Mary A Adkisson
- Michael Kirka
- Nance Ericson
- Oscar Martinez
- Raymond Borges Hink
- Rob Root
- Samudra Dasgupta
- Sana Elyas
- Srikanth Yoginath
- Subhabrata Saha
- T Oesch
- Tomonori Saito
- Tony Beard
- Tony L Schmitz
- Tyler Smith
- Varisara Tansakul
- Vipin Kumar
- Vladimir Orlyanchik
- Yarom Polsky

The technology will offer supportless DIW of complex structures using vinyl ester resin, facilitated by multidirectional 6 axis printing.

The ever-changing cellular communication landscape makes it difficult to identify, map, and localize commercial and private cellular base stations (PCBS).

The technologies provide additively manufactured thermal protection system.

System and method for part porosity monitoring of additively manufactured components using machining
In additive manufacturing, choice of process parameters for a given material and geometry can result in porosities in the build volume, which can result in scrap.

Reflective and emissive surfaces are designed with heat retention as opposed to the current state of the art oven and furnaces which use non-reflective surfaces. Heat is absorbed and transferred to the exterior of the heated appliances.

This invention focuses on improving the ceramic yield of preceramic polymers by tuning the crosslinking process that occurs during vat photopolymerization (VP).

Distortion generated during additive manufacturing of metallic components affect the build as well as the baseplate geometries. These distortions are significant enough to disqualify components for functional purposes.

For additive manufacturing of large-scale parts, significant distortion can result from residual stresses during deposition and cooling. This can result in part scraps if the final part geometry is not contained in the additively manufactured preform.

The QVis Quantum Device Circuit Optimization Module gives users the ability to map a circuit to a specific quantum devices based on the device specifications.