Bio
Yong Chae Lim is a R&D staff member at Materials Joining Group in the Materials Science & Technology Division at Oak Ridge National Laboratory (ORNL). Prior joining to ORNL, he earned Ph.D. at The Ohio State University (OSU). His research experiences at OSU are multi-scale manufacturing process development, such as arc welding, laser assisted hybrid arc welding, and ultrafast laser ablation, evaluation and characterization of material properties. He is currently working on various projects, including novel solid-state processing and joining process development for lightweight multi-materials vehicles, laser and atmosphere plasma surface modifications to improve joint performance and/or corrosion resistance of dissimilar materials joints and for bipolar plate, mechanical and metallurgical characterization of friction stir welded high strength steel, low frequency hydrogen fatigue test for high strength steels, and high pressure hydrogen storage application. He was the recipient of international scholarship from American Welding Society (AWS) at 2004 and 2006 and is currently member of AWS, The Mineral, Metals and Materials Society, and Adhesion Society.
Professional Service
- Committee Member for Shaping and Forming Committee at The Minerals, Metals, and Materials Society
- International editorial board member for Journal of Welding and Joining
- Invited guest editor for journal of “Materials” special issue “Mechanical and metallurgical characterizations of advanced alloys.” (Mar. 2020~ Dec. 2022)
- Secretary for Northeast Tennessee #071 (District 08) Chapter for American Welding Society (2016~ Jun, 2019)
Professional Affiliations
- Member of American Welding Society
- Member of The Minerals, Metals, and Materials Society
Trademarks and Patents
- Y.C. Lim, J.H. Jun, M. Brady, Z. Feng, “Fastener joint and associated method for avoiding corrosion of dissimilar material faster joints,” US Patent 11,808,297 B2.
- Y.C. Lim, J. Chen, Z. Feng, X. Sun, R.W. Davies, “Ultrasonic rivet joining of dissimilar materials,” US Patent 11,253,908 B2.