Planar Bond All: A New Packaging Technology for Advanced Automotive Power Modules... Conference Paper September, 2012
Junction Temperature Measurement of IGBTs Using Short Circuit Current Conference Paper September, 2012
A 200 C Universal Gate Driver Integrated Circuit for Extreme Environment Applications Journal September, 2012
Development of a 10 kW High Temperature High Power Density Three-Phase AC-DC-AC SiC Converter Journal September, 2012
Development and Experimental Characterization of a Multiple Isolated Flux Path Reluctance Machine Conference Paper September, 2012
EV Charging Through Wireless Power Transfer: Analysis of Efficiency Optimization and Technology Trends Conference Paper September, 2012
GRID SIDE REGULATION OF WIRELESS POWER CHARGING OF PLUG-IN ELECTRIC VEHICLES Conference Paper September, 2012
Calorimeter Evaluation of Inverter Grade Metalized Film Capacitor ESR... Conference Paper September, 2012
Planar Bond All: A New Packaging Technology for Advanced Automotive Power Modules... Conference Paper September, 2012
Real time selective harmonic minimization for multilevel inverters using genetic algorithm and artifical neural network angle... Conference Paper June, 2012
