Advanced Packaging of SiC Power Module for Automotive Applications... Conference Paper September, 2013
Junction Temperature Measurement of IGBTs Using Short Circuit Current Conference Paper September, 2012
Planar Bond All: A New Packaging Technology for Advanced Automotive Power Modules... Conference Paper September, 2012
Planar Bond All: A New Packaging Technology for Advanced Automotive Power Modules... Conference Paper September, 2012
Real Power and Reactive Power Control of a Three-Phase Single-Stage-PV System and PV voltage Stability... Conference Paper July, 2012
Air Conditioning Stall Phenomenon – Testing, Model Development, and Simulation Conference Paper May, 2012
Reducing Parasitic Electrical Parameters with a Planar Interconnection Packaging Structure... Conference Paper March, 2012
Si IGBT Phase-Leg Module Packaging and Cooling Design for Operation at 200˚C in Hybrid Electrical Vehicle Applications Conference Paper February, 2012
