A novel creep resistant Cu-based CuCrNbZr alloy with high thermal conductivity

INVENTION REFERENCE NUMBER

202105008

  • Energy and Utilities
  • Materials

The technology describes a creep resistant Cu-based alloy with high thermal conductivity.


Inventors

Ling Wang Buildings & Transportation Science Division


Contact

To learn more about this technology, email [email protected] or call 865-574-1051.