Head shot photograph of Whit Vinson in July of 2025.

Whit Vinson

R&D Associate, Power Electronics Packaging

Whit Vinson received his Ph.D., M.S., and B.S. in Mechanical Engineering from the University of Arkansas in Fayetteville. During graduate school, he gained experimental and computational experience within packaging, reliability evaluation, multi-physical interactions, and thermal management for micro- and power electronics. Whit joined the Vehicle Power Electronics Research Group at ORNL in August of 2025 as a UT-ORII Fellow.