May 2014

Conference Paper

Uniqueness and Challenges of Sintered Silver as a Bonded Interface Material

By:
Wereszczak, Andrew A; Liang, Zhenxian ; Ferber, Mattison K; Marlino, Laura D
Page Number:
178-187
Publication Date:
May 2014
Conference Name:
International Conference on High Temperature Electronics (HiTEC 2014)
Conference Location:
Albuquerque, New Mexico, United States of America

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