January 2014

Journal

Thermally Conductive MgO-Filled Epoxy Molding Compounds

By:
Wereszczak, Andrew A; Morrissey, Timothy G; Volante, Charles; Farris, Phillip; Groele, Robert; Wiles, Randy H; Wang, Hsin
Journal Name:
IEEE Transactions on Components, Packaging, and Manufacturing Technology
Page Number:
1994-2005
Volume:
3
Issue Number:
12
Publication Date:
January 2014
View DOI Listing:
https://doi.org/10.1109/TCPMT.2013.2281212