March 2013

Journal

Thermal Processing Effects on Microstructure and Composition of Cu3SbSe3

By:
Majsztrik, Paul W; Kirkham, Melanie J; Garcia Negron, Valerie; Lara-Curzio, Edgar ; Skoug, E.; Morelli, Donold
Journal Name:
Journal of Materials Science
Page Number:
2188-2199
Volume:
48
Issue Number:
5
Publication Date:
March 2013
View DOI Listing:
https://doi.org/10.1007/s10853-012-6994-x

Abstract

We report on the effects of thermal processing on the microstructure and composition of a system with overall stoichiometry of 3Cu:1Sb:3Se with the aim of producing single-phase Cu3SbSe3. It was found that slowly cooling from the melt produced a multiphase material consisting of Cu2Se and CuSbSe2, but devoid of Cu3SbSe3. Cooling rapidly from the melt resulted in three-phase microstructures consisting of Cu2Se, CuSbSe2, and Cu3SbSe3. Subsequent annealing of the three-phase material between 325°C and 400˚C shifted composition towards nearly pure Cu3SbSe3, the target compound of this work. The kinetics of the transformation into Cu3SbSe3 is successfully described using a modified Avrami model, which suggests that diffusion is the rate-controlling step. Values of Young’s modulus and hardness, obtained by nanoindentation, are reported for Cu2Se, CuSbSe2, and Cu3SbSe3.