September 2016

Journal

Thermal activation mechanisms and Labusch-type strengthening analysis for a family of high-entropy and equiatomic solid-solution alloys

By:
Wu, Zhenggang ; Gao, Yanfei ; Bei, Hongbin
Journal Name:
Acta Materialia
Page Number:
108-119
Volume:
120
Issue Number:
N/A
Publication Date:
September 2016
View DOI Listing:
https://doi.org/10.1016/j.actamat.2016.08.047