January 2024

Conference Paper

Surface Merging Technique to Design GA-Optimized Heat Sinks

By:
Barua, Himel ; Xue, Lingxiao ; Ozpineci, Burak
Page Number:
6120-6125
Book Title:
2023 IEEE Energy Conversion Congress and Exposition (ECCE)
Publication Date:
January 2024
Publisher Location:
IEEE, New Jersey, United States of America
Conference Name:
Energy Conversion Congress and Expo
Conference Location:
Nashville, Tennessee, United States of America
Conference Sponsor:
IEEE
View DOI Listing:
https://doi.org/10.1109/ECCE53617.2023.10362624

Abstract

High-power density inverters require efficient and small heat dissipation systems. For liquid cooling systems, an effective heat sink design is important to enable higher heat transfer and keep the pressure drop within reasonable limits. A heat sink geometry generated from an extruded, 1D fast Fourier transform can achieve more even temperature distribution and improved heat transfer than a conventional heat sink. Building on this concept, this paper proposes a new heat sink geometry creation algorithm. Instead of one plane profile being extruded, multiple plane profiles, each created from the fast Fourier transform method, are subsequently merged by smooth surfaces along the flow direction of the heat sink. Thus, a 3D heat sink geometry is created that enables 3D coolant flow and efficient heat transfer. The volume of this design was reduced by 50% compared with pin fin heat sinks. Compared with extruded 1D fast Fourier transform heat sinks, the proposed design showed an approximately 5% device temperature reduction and a 20% pressure drop reduction.