March 2012

Conference Paper

Sintered Silver Joint Strength Dependence on Substrate Topography and Attachment Pad Geometry

By:
Wereszczak, Andrew A; Vuono, Daniel J; Liang, Zhenxian ; Fox, Ethan E
Publication Date:
March 2012
Conference Name:
International Conference on Integrated Power Electronics Systems (CIPS)
Conference Location:
Nuremberg, Germany

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