January 2006

Journal

Simulation of copper atom diffusion via the vacancy mechanism in a dilute Fe-Cu alloy.

By:
Arokiam, Alan; Barashev, Aleksandr; Bacon, David; Osetskiy, Yury N
Journal Name:
Physical Review B
Page Number:
174-205
Volume:
71
Issue Number:
N/A
Publication Date:
January 2006

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