September 2013

Conference Paper

Reducing Parasitic Electrical Parameters with a Planar Interconnection Packaging Structure

By:
Liang, Zhenxian ; Ning, Puqi ; Wang, Fei ; Marlino, Laura D
Publication Date:
September 2013
Conference Name:
CIPS 2012 - International Conference on Integrated Power Electronics Systems
Conference Location:
Nuremberg, Germany