September 2013

Conference Paper

Planar Bond All: A New Packaging Technology for Advanced Automotive Power Modules

By:
Liang, Zhenxian ; Ning, Puqi ; Wang, Fei ; Marlino, Laura D
Page Number:
438-443
Publication Date:
September 2013
Conference Name:
The 4th IEEE Energy Conversion Congress and Exposition (ECCE12)
Conference Location:
Raleigh, North Carolina, United States of America