September 2012

Conference Paper

Planar Bond All: A New Packaging Technology for Advanced Automotive Power Modules

By:
Liang, Zhenxian ; Ning, Puqi ; Wang, Fei ; Marlino, Laura D
Publication Date:
September 2012
Conference Name:
IEEE Energy Conservation Congress & Exposition 2012 (ECCE2012)
Conference Location:
Raleigh, North Carolina, United States of America