July 2016

Conference Paper

Parasitic Inductance Extraction and Verification for 3D Planar Bond All Module

By:
Liang, Zhenxian ; Wang, Zhiqiang ; Wang, Fei
Publication Date:
July 2016
Conference Name:
International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)
Conference Location:
Raleigh, North Carolina, United States of America