May 2016

Conference Paper

Method to Determine Maximum Allowable Sinterable Silver Interconnect Size

By:
Wereszczak, Andrew A; Modugno, Max C; Waters, Shirley B; DeVoto, Douglas; Paret, Paul
Publication Date:
May 2016
Conference Name:
2016 IMAPS International Conference on High Temperature Electronics (HiTEC 2016)
Conference Location:
Albuquerque, New Mexico, United States of America