November 2023

Book Chapter

Emerging Packaging Concepts and Technologies

By:
Gurpinar, Emre ; Ozpineci, Burak
Page Number:
313-332
Book Title:
SiC Power Module Design: Performance, Robustness and Reliability
Publication Date:
November 2023
Publisher Location:
The Institution of Engineering and Technology, London, United Kingdom
View DOI Listing:
https://doi.org/10.1049/PBPO151E_ch13

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