March 2013

Conference Paper

Double-Sided Cooling Design for Novel Planar Module

By:
Ning, Puqi ; Liang, Zhenxian ; Marlino, Laura D; Wang, Fei
Page Number:
616-621
Publication Date:
March 2013
Conference Name:
The Applied Power Electronics Conference and Exposition
Conference Location:
Long Beach, California, United States of America

Abstract

A novel packaging structure for medium power modules featuring power semiconductor switches sandwiched between two symmetric substrates that fulfill electrical conduction and insulation functions is presented. Large bonding areas between dies and substrates allow this packaging technology to offer significant improvements in electrical, thermal performance. Double-sided cooling system was dedicatedly analyzed and designed for different applications.