Direct Observations of Silver Nanoink Sintering and Eutectic Remelt Reaction with Copper

Abstract

Ag nanoink sintering kinetics and subsequent melting is studied using in-situ synchrotron based x-ray diffraction. Direct observations of Ag nanoink sintering on Cu demonstrate its potential for materials joining since the Ag nanoink sinters at low temperatures but melts at high temperatures. Results show low expansion coefficient of sintered Ag, non-linear expansion as Ag densifies and interdiffuses with Cu above 500ºC, remelting consistent with bulk Ag, and eutectic reaction with Cu demonstrating its usefulness as a high temperature bonding medium