Skip to main content

Automated Wire Bonder

FHN Automated Wire Bonder

The HB100 wire bonder is fully automated, allowing for “hands-off” bonding from research scale samples to sample carriers within a glovebox environment. 


  • Automated, motorized xyz axis and rotatable head for automatic bond processes
  • 17 to 75 um gold, aluminum, silver, or copper wire  
  • Automatic bond height adjustment via z-axis sensor that identifies touch down and sets height parameters
  • Pattern recognition through machine vision for automatic position correction 
  • High resolution 21” touch screen for UI
  • Deep and wide bond access via special bond head design
  • One bond head for wedge, ball, bump, and ribbon bonding
  • Simple loop programming for individual loop profiles consisting of up to 10 steps