The HB100 wire bonder is fully automated, allowing for “hands-off” bonding from research scale samples to sample carriers within a glovebox environment.
Specifications
- Automated, motorized xyz axis and rotatable head for automatic bond processes
- 17 to 75 um gold, aluminum, silver, or copper wire
- Automatic bond height adjustment via z-axis sensor that identifies touch down and sets height parameters
- Pattern recognition through machine vision for automatic position correction
- High resolution 21” touch screen for UI
- Deep and wide bond access via special bond head design
- One bond head for wedge, ball, bump, and ribbon bonding
- Simple loop programming for individual loop profiles consisting of up to 10 steps
