November 2023

Conference Paper

TISCC: A Surface Code Compiler and Resource Estimator for Trapped-Ion Processors

By:
LeBlond, Tyler R; Bennink, Ryan S; Lietz, Justin G; Seck, Christopher M
Page Number:
1426-1435
Issue Number:
n/a
Book Title:
SC-W '23: Proceedings of the SC '23 Workshops of The International Conference on High Performance Computing, Network, Storage, and Analysis
Publication Date:
November 2023
Publisher Location:
Association for Computing Machinery, New York, New York, United States of America
Conference Name:
SC '23 Workshops of The International Conference on High Performance Computing, Network, Storage, and Analysis
Conference Location:
Denver, Colorado, United States of America
Conference Sponsor:
SIGHPC
View DOI Listing:
https://doi.org/10.1145/3624062.3624214

Abstract

We introduce the Trapped-Ion Surface Code Compiler (TISCC), a software tool that generates circuits for a universal set of surface code patch operations in terms of a native trapped-ion gate set. To accomplish this, TISCC manages an internal representation of a trapped-ion system where a repeating pattern of trapping zones and junctions is arranged in an arbitrarily large rectangular grid. Surface code operations are compiled by instantiating surface code patches on the grid and using methods to generate transversal operations over data qubits, rounds of error correction over stabilizer plaquettes, and/or lattice surgery operations between neighboring patches. Beyond the implementation of a basic surface code instruction set, TISCC contains corner movement functionality and a patch translation that is implemented using ion movement alone. Except in the latter case, all TISCC functionality is extensible to alternative grid-like hardware architectures. TISCC output has been verified using the Oak Ridge Quasi-Clifford Simulator (ORQCS).