Bio
Dr. William F Godoy joined ORNL in 2016, and is a Senior Computer Scientist in the Computational Science and Mathematics Division, CSMD. A native of Peru, his background is in Mechanical Engineering with research interests on high-performance computing (HPC), programming models, workflows, energy in computing, and AI for HPC.
Dr. Godoy obtained his PhD (2009) and MS (2006) degrees from the State University of New York at Buffalo, working under the supervision of Dr. Paul E. DesJardin on 3D radiative transfer parallel computational models. Before ORNL, he was a a Senior Software Engineer at Intel Co. (2012-2016) using HPC for the R&D of thermal-reliability models for chip designs; and a postdoctoral fellow at NASA Langley (2009-2012) researching Jacobian-Free Newton Krylov methods and early-adoption of GPU computing for radiative transfer.
At ORNL, Dr. Godoy contributed to the US Department of Energy (DOE) Exascale Computing Project (ECP) as (i) the architect and core developer of the widely-used ADIOS2 library for parallel I/O in HPC, (ii) contributor to the advancement of the QMCPACK software, and (iii) researching novel high-productivity programming for HPC - which led to best papers SC23 WORKS and SC24 XLOOP, and the first paper on applying state-of-the-art large language models (LLMs) to HPC programming. He also worked on improving the file loading times and performance of data reduction workflows impacting users at ORNL neutron science facilities: SNS and HFIR.
Dr. Godoy is currently funded by the US DOE Advanced Scientific Computing Research (ASCR) and serves as co-PI and member on projects tarting AI for Science (Ellora and Durban), High-productivity languages and advancing the DOE HPC software ecosystem (S4PST and PESO). Recent efforts include contributions to LLMs for HPC programming: ChatBLAS, ChatHPC; the JACC library to enable performance portability for science users of the Julia language, and a best paper on a first study of the Mojo language for science. He also serves as a mentor on several internship programs and technical committees in IEEE and ACM venues (IPDPS, HiPC, ICPP, SC, etc.), such as chairing the SC25 reproducibility challenge committee. He is a senior member of IEEE, a member of ACM, and a member of ASME.
Professional Experience
2022-Present Senior Computer Scientist, Computer Science and Mathematics Division, ORNL
2016-2021 Computer Scientist, Computer Science and Mathematics Division, ORNL
2012-2016 Senior Software Engineer, Process Technology Modeling, Intel Corporation
2009-2012 Postdoctoral Fellow, NASA Langley Research Center
2004-2009 Research Assistant/PhD Student, SUNY Buffalo
Awards
Best Paper, SC25 WACCPD: Twelfth Workshop on Accelerator Programming and Directives, 2025
Best Research Poster Finalist for Julia with Intelligent Runtime for Heterogeneous Computing, SC25, 2025
Best Research Poster Finalist, ACM undergraduate research poster competition (mentor), SC25, 2025
Supplementary Performance Award, ORNL, 2025
Most Innovative Accomplishment Team Award for ChatBLAS, CCSD Annual Awards, 2025
Best Paper, SC24 XLOOP: 6th Annual Workshop on Extreme-Scale Experiment-in-the-Loop Computing, 2024
Best Research Poster Finalist for JACC.jl, SC24, 2024
Best Tutorial, Performance Portability on Julia with JACC.jl, ORNL Software Expo, 2024
Outstanding Mentor Award, CSMD, 2023
Best Paper, SC23 WORKS: 18th Workshop on Workflows in Support of Large-Scale Science, 2023
Better Scientific Software Fellowship, Honorable Mention, 2022
Director Division Award, CSMD, 2021
Most Integrated Project Award, Ugly Data Days, CSMD/SNS, 2018
Supplementary Performance Award, ORNL, 2017
Department Recognition Award, Process Technology Modeling, Intel Corporation, 2014
NASA Postdoctoral Fellowship Award, 2009
Professional Service
SC25 Technical Committee, Reproducibility Challenge Chair
Technical committee in several past IEEE (IPDPS) and ACM (ICPP) conferences including SC.
Professional Affiliations
IEEE Senior Member
ACM Member
ASME Member